特性/ Features
无卤产品，Halogen-free product
良好的导热性能，热导率≥1.0W/ m·K / Excellent thermal conductivity, ≥1.0W/ m·K
优秀的机械加工性 / Excellent mechanical processability
优异的耐热性能，适应无铅制程 / Excellent solder heat endurance, Lead-free compatible CEM-3 laminate
主要特性 / General properties
检测项目 Item | 单位 Unit | 检测条件 Test Condition | 规范值 Spec | 类型1 Type 1 | 类型2 Type 2 | |
热导率 Thermal Conductivity | W/ m·K | ASTM D 5470 | ≥1.0 | 1.04 | 1.51 | |
玻璃化转变温度Tg | ℃ | DSC | ≥110 | 130 | 130 | |
剥离强度 1oz Peel Strength | N/mm | 288℃, 10S | ≥1.05 | 1.21 | 1.20 | |
热应力 Thermal stress | S | 288℃,solder dip | ＞10 | 50s No delamination | 50s No delamination | |
弯曲强度 Flexural Strength | N/mm2 | 经向 LW | ≥276 | 330 | 330 | |
纬向CW | ≥186 | 237 | 237 | |||
燃烧性Flammability | － | E 24/125 | UL94V-0 | V-0 | V-0 | |
表面电阻 Surface Resistivity | MΩ | After moisture | ≥1.0×104 | 4.32×106 | 4.22×106 | |
体积电阻 Volume Resistivity | MΩ·cm | After moisture | ≥1.0×106 | 3.55×108 | 3.56×108 | |
介电常数 Dielectric Constant | － | C 24/23/50 | —— | 5.4 | 5.7 | |
介质损耗角正切 Loss Tangent | － | C 24/23/50 | ≤0.035 | 0.019 | 0.018 | |
耐电弧Arc Resistance | S | D48/50＋D0.5/23 | ≥60 | 125 | 125 | |
击穿电压 Breakdown Voltage | KV | IPC-TM-650 2.5.6.2 D48/50＋D0.5/23 | ≥40 | 60 | 60 | |
卤素含量Halogen content | Cl | ppm | EDX-GP | ≤900 | 480 | 480 |
Br | ppm | ≤900 | 30 | 30 | ||
Cl+Br | ppm | ≤1500 | 510 | 510 | ||
吸水率 Moisture Absorption | % | D24/23 | ≤0.5 | 0.30 | 0.30 | |
CTI | V | IEC-60112 | ≥600 | 600 | 600 | |
Specimen Thickness : 1.6mm ;
Explanation: C: Humidity conditioning;
D:Immersion conditioning in distilled water ;
E:Temperature conditioning ;
主要应用Applications
产品系列 / Purchasing information
厚度Thickness | 铜箔Copper foil | 标准尺寸 Standard size |
0.8~3.2mm | 18um ~ 105um | 37"×49"、41"×49"、43"×49" |
※ any specific require could be available upon request